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(Article appeared in
May 2008 issue of Ceramic Industry)
Spark Plasma
Sintering
Robert
Aalund, Business Development Manager, Thermal Technology, LLC Elgin,
Ill.
The spark plasma sintering process
offers significant improvements over conventional hot press and hot
isostatic press sintering.
Spark plasma sintering (SPS) is a
high-speed powder consolidation/sintering technology capable of
processing conductive and nonconductive materials. Theories on the
spark plasma sintering process vary, but most commonly accepted is
the micro-spark/plasma concept which is based on the electrical
spark discharge phenomenon wherein a high-energy, low-voltage pulse
current momentarily generates spark plasma at high temperatures
(many thousands of °C) in fine areas between the particles.
Spark plasma sintering’s operational
or “monitored” temperatures (200-2400°C) are commonly 200 to 500°C
lower than with conventional sintering, classifying SPS as a
lower-temperature sintering technology. Material processing
(pressure and temperature rise and hold time) is completed in short
periods of approximately 5 to 25 minutes. The relatively low
temperatures combined with fast processing times ensure tight
control over grain growth and microstructure.

Figure 1. Basic configuration of an SPS machine.
Process
Spark plasma sintering
utilizes uniaxial force and ON-OFF DC pulse energizing. The ON-OFF
DC pulse voltage and current creates spark discharge and Joule heat
points between material particles (high-energy pulses at the point
of intergranular bonding). The high frequency transfers and
disperses the spark/Joule heat phenomena throughout the specimen,
resulting in a rapid and thorough heat distribution, high
homogeneity and consistent densities.
The initiation of the spark discharge
in the gap between particles is assisted by fine impurities and
gases on and between the surfaces of the particles. The spark
discharge creates a momentary, local high-temperature state of up to
10,000°C causing vaporization of both the impurities and the
surfaces of the particles in the area of the spark. Immediately
behind the area of vaporization, the particle surface melts. Via
electron draw during ON TIME and the vacuum of OFF TIME, these
liquidized surfaces are drawn together, creating “necks.” The
ongoing “radiant” Joule heat and pressure causes these necks to
gradually develop and increase. The radiant heat also causes
plastic deformation on the surface of the particles, which is
necessary for higher-density applications.
During the spark plasma sintering
process, heat is concentrated primarily on the surface of the
particles. Particle growth is limited due to the speed of the
process and the fact that only the surface temperature of the
particles rises rapidly. The entire process – from powder to
finished bulk sample – is completed quickly, with high uniformity
and without changing the particles’ characteristics.
Force (pressure) plays an important
and predictable role in curbing particulate growth and influencing
overall densities, but in the SPS process, accurate manipulation of
force can actually enhance the process. Force multiplies spark
initiation (diffusion) throughout the sample as the material moves
under pressure, especially during critical out-gassing stages. Both
too much and too little pressure can negatively influence the
process. In large samples where high density is required, force is
commonly increased in stages to enhance out-gassing and electrical
diffusion.

Figure 2. ON-OFF pulsed
current path through the machine.
Applications
Spark plasma sintering is effective for any powder material
application, but interest is especially high for nanocrystalline
structures. Generally, super-fine materials have more surface area
per volume than the same material made with larger particles. This,
along with the way the particles interact once compacted,
“amplifies” material characteristics. In theory, high strength
materials show an increase in strength, highly wear-resistant
materials show higher wear resistance, highly magnetic show higher
magnetism, and so on. Suitable applications include advanced
lightweight armament, guidance optics and ultra-high-strength
tooling.
Nanomaterials haven’t seen much
industrial commercialization to date because conventional sintering
technologies cause substantial particulate damage and growth.
However, since SPS technology can sinter nanocrystalline materials
with very little grain growth and negative particulate effect, the
door is now open to test and study new ideas in powder material
applications. Many common materials may well find new applications
with substantially improved characteristics.
SPS technology can sinter materials
without the use of binders. Most conventional powdered material
sintering technologies require pre-forming and binders, and in many
cases, expensive binder removal processes. Binders weaken the part
due to their susceptibility to chemical wear, reduced hardness and
strength, and oxidation breakdown. The availability of binder-less
material could be valuable in numerous applications, including
cobalt-less tungsten carbide, high-purity ceramic fuel cells and
ceramic optics.

Figure 3. ON-OFF pulsed
current path through the powder.
Part Characteristics
The rapid spark diffusion and the consistent heat throughout the
part produces very little internal stress within a part made with
spark plasma sintering. Many part failures occur due to internal
stress and micro-cracks caused by heat migration during conventional
sintering. SPS technology binds particles with electrical discharge
energy evenly throughout the part. The heat is simultaneously
consistent at the outside of the part and the center. Along with
the relative speed of the process, this eliminates much of the
internal stress commonly seen in conventionally sintered parts.
SPS technology is capable of
achieving nearly 100% theoretical density in almost any
metallurgical or ceramic material, including composites. When
ultra-high densities are required, some grain growth is necessary.
Some materials require added binders to facilitate density with less
grain growth, while other applications require very specific and
uniform porosity. By accurately controlling pressure and
temperature, SPS technology can control material porosity while
maintaining strong particle bonds throughout the shape.
“Net” and “near-net” shapes are also
possible with SPS, going directly from powder to finish part in one
step. Currently, these shapes need to be symmetrical and relatively
simple; a complex shape would require secondary machining.
SPS technology can produce true
seamless bonding (dry and liquid phase bonding). Because the SPS
process draws particles together and offers the ability to reach
nearly 100% theoretical density, the process can produce bonded
parts that have no seam. This bonding phenomenon is possible between
like and dissimilar materials, though radically dissimilar materials
require progressing layers between materials to account for
different thermal stresses. In the case of bonding rough surfaces,
loose powder can be applied between the surfaces to ensure a
high-density bond.

Figure 4. Example of a
production concept.
Benefits
As mentioned previously, the SPS process utilizes high-amperage
pulse DC current to generate spark plasma energy between each
particle. Physical compression can be up to 300 tons and the chamber
is under negative atmospheric pressure (vacuum) with or without
inert gas. Heat is concentrated on the surface area of each particle
and every particle is equally and completely bonded with the
surrounding particles. Under high pressure, mild plastic deformation
of particles ensures ultra-high density values, while high-porosity,
fully bonded materials can be achieved with lower pressure and less
heat and time.
Pre-existing oxidation and
contaminates are vaporized from particle surfaces during sintering
providing higher-purity materials and stronger bonding between
particles. SPS is capable of sintering dissimilar materials without
going to a liquid phase on the lower temperature materials. In the
case of composite materials, high homogeneity is possible even with
lower densities. In the case of layered materials known as
functionally graded materials (FGMs), preformed layers remain
consistent in density and shape even if the materials have radically
different sintering properties.
Consideration of a powdered
metallurgical “recipe” requires metallurgical expertise, but the
actual operation of the machine is quite simple.
Once the die set is loaded and the temperature feedback
system (thermocouple or pyrometer) is in place, the operator
programs the temperature and pressure ramp-up and hold settings.
The atmosphere (vacuum and/or inert gas) is set, the electrical
settings (ON-OFF times and frequency strategy) are programmed and
then the data feedback graphics are set up.
SPS technology can also be
combined with various forms of production and automation systems,
including multi-head, rotary, batch and conveyor systems. Robotic
interface is also possible.
Finally, SPS operational expenses are
consistently 50 to 80% less than conventional sintering
technologies, due primarily to speed. In some applications, SPS
technology has been more than 20 times faster than conventional
sintering technologies. Most SPS applications only require minutes
in comparison to the hours needed with conventional systems.
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